SEMICONDUCTOR PACKAGING
Optimize Semiconductor Packaging with Data-Driven Precision
The Semiconductor Packaging industry is experiencing unprecedented growth, driven by significant government investments and initiatives like the US CHIPS Act, the Korea Semiconductor Industry Promotion Plan, and the European Chips Act. For many, bringing new facilities online quickly and effectively is a new challenge. Arch Systems provides the expertise, real-time insights, and AI-driven solutions needed to navigate this growth and achieve operational excellence.
Optimize Semiconductor Packaging
with Data-Driven Precision
The Semiconductor Packaging industry is experiencing unprecedented growth, driven by significant government investments and initiatives like the US CHIPS Act, the Korea Semiconductor Industry Promotion Plan, and the European Chips Act. For many, bringing new facilities online quickly and effectively is a new challenge. Arch Systems provides the expertise, real-time insights, and AI-driven solutions needed to navigate this growth and achieve operational excellence.
KEY BENEFITS:
KEY BENEFITS:
Enhanced Yield Management:
Utilize real-time and predictive analytics to improve yield rates, reduce waste, and maximize productivity.
Compliance Assurance:
Adhere to standards like ISO 9001 and IATF 16949 and manage an advanced data and AI strategy in line with export controls such as ITAR or NIST 800-171 controlled information with robust data tracking and reporting.
Machine Connectivity:
Seamlessly integrate with leading semiconductor packaging equipment (ASM, Besi, Palomar, etc.) via any vendor proprietary protocol or using domain-specific standards (CFX, SECS/GEM) and general protocols (MQTT, OPC-UA, SQL DB). Easily connect with existing MES and other systems in our growing partner library as well as through no-code solutions for streamlined customization.
Process Optimization:
Optimize packaging processes with AI-driven insights, ensuring consistent quality and performance.
